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PCB流程二
2014-12-24 13:52:27

利用化學微蝕方式粗化銅面並用棕化藥水在銅面生成一層氧化銅,增大銅導體與樹脂的接觸表面積增強結合力
Coarsen the surface by micro-etching and form copper oxide on the surface by brown solution,add the adhension between conductor and resin.


將組合后之多層板與銅箔/PP進行疊合以利后續壓合作業
Multilayers after combination should be lay up with copper foil and PP.


將疊合好的待壓板利用高溫高壓的方式熔合黏結成多層板
Multilayers after lay up should be bonded by high temperature and pressure.

將壓合好之冊板與 lay up 相反程序拆出分開疊放.
Use the mark line to unload the finished laminition boards which is just oppsite with the lay up procedure and separate them one by one.

通過X-RAY /CCD對位系統抓取內層靶標,再利用高速運轉的主軸配合鉆頭將其定位孔鉆出
Get the target in inner layer by X-ray/CCD and drill location hole by drill bits and spindle with high speed.

利用撈邊機將板邊多余流膠去除。
Performing LM routing cut the useless flowed resin on the boards edge.

 

 

 
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